In such cases, use a resistive matching pad-which inherently goes down to DC as well as as high as you need when carefully constructed with chip resistors.
2.
In order to mount the chip to external circuitry ( e . g ., a circuit board or another chip or wafer ), it is flipped over so that its top side faces down, and aligned so that its pads align with matching pads on the external circuit, and then the solder is reflowed to complete the interconnect.
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